Official summary · Nederlands
What is being procured?
The main purpose of this FIB/SEM equipment is to perform material milling (cutting), 3D characterization, and cross section analysis of epitaxially grown InP, InGaAs, InAlGaAs and InGaAsP layers on InP substrates. The structures may also contain polymer-based planarization layers, SiOx or SiNx dielectric layers and TiPtAu or NiGeAu metal layers. Levering van één SEM +FIB systeem
Source and reliability
Source: official TED notice 519634-2026, last checked Aug 21, 2026, 7:06 PM. The original publication remains authoritative.
Data is restructured for easier reading. The official notice and procurement documents always prevail.