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Result notice · TED 667627-2026 ·

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Germany · Laboratory, optical and precision equipment

Official title · English

Flip Chip Die Bonder

FAIR - Facility for Antiproton and Ion Research in Europe GmbH · Germany

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Official summary

What is being procured?

In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.

Deadline Sep 22, 2026 12:00 UTC+02:00
Estimated valueNot announced
PublishedAug 24, 2026
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Notice history

Procurement timeline

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  1. Competition notice Notice being viewed

    · TED 582477-2026

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  2. Result notice

    · TED 667627-2026

    View notice on Tenderiva

    Open official notice ↗

Data is restructured for easier reading. The official notice and procurement documents always prevail.

Source and reliability

TED · 582477-2026. Checked on Aug 27, 2026, 10:05 AM.

Data is restructured for easier reading. The official notice and procurement documents always prevail.

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