Official summary
What is being procured?
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
Source and reliability
Source: official TED notice 582477-2026, last checked Aug 24, 2026, 8:05 AM. The original publication remains authoritative.
Data is restructured for easier reading. The official notice and procurement documents always prevail.