Hemm pubblikazzjoni aktar reċenti disponibbli.
Avviż tar-riżultat · TED 667627-2026 ·
il-Ġermanja · Tagħmir tal-laboratorju, ottiku u ta’ preċiżjoni
Titlu uffiċjali · English
Traduzzjoni awtomatika indikattiva biex tiffaċilita l-qari. It-titlu uffiċjali hawn taħt jipprevali.
Titlu uffiċjali · English
Flip Chip Die Bonder
Id-data hija ristrutturata biex tinqara aktar faċilment. L-avviż uffiċjali u d-dokumenti tal-akkwist dejjem jipprevalu.
FAIR - Facility for Antiproton and Ion Research in Europe GmbH · il-Ġermanja
Ara avviżi taħt dan l-isemSommarju uffiċjali · English
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
Traduzzjoni awtomatika indikattiva. Is-sommarju uffiċjali jibqa’ r-referenza.
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
Storja tal-avviżi
Segwi l-istadji ewlenin u l-aġġornamenti marbuta ma’ din il-proċedura ta’ akkwist.
Id-data hija ristrutturata biex tinqara aktar faċilment. L-avviż uffiċjali u d-dokumenti tal-akkwist dejjem jipprevalu.
TED · 582477-2026. Iċċekkjat fil-27 Aww 2026 10:05.
Id-data hija ristrutturata biex tinqara aktar faċilment. L-avviż uffiċjali u d-dokumenti tal-akkwist dejjem jipprevalu.
