Official summary
What is being procured?
Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning.
Notice history
Procurement timeline
Follow the main stages and updates linked to this procurement procedure.
Data is restructured for easier reading. The official notice and procurement documents always prevail.
Source and reliability
TED · 693624-2026. Checked on Oct 8, 2026, 11:05 AM.
Data is restructured for easier reading. The official notice and procurement documents always prevail.