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Sweden · Industrial machinery

Official title · English

Deep Reaction Ion Etcher (DRIE)

Uppsala universitet · Sweden

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Official summary

Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range…

What is being procured?
Deadline Nov 10, 2026 00:00 UTC+01:00
Estimated value1 SEK
PublishedOct 12, 2026
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Official summary

What is being procured?

Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning.

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TED · 700865-2026. Checked on Oct 12, 2026, 11:05 AM.
https://ted.europa.eu/en/notice/-/detail/700865-2026

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  1. Competition notice

    · TED 693624-2026

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  2. Correction notice Notice being viewed

    · TED 700865-2026

    Changed sections: 1 Open official notice ↗

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TED · 700865-2026. Checked on Oct 12, 2026, 11:05 AM.

Data is restructured for easier reading. The official notice and procurement documents always prevail.

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