Closed TED · Source

Finland · Laboratory, optical and precision equipment

Official title · English

Wafer metrology

VTT Technical Research Centre of Finland Ltd · Finland

View notices under this name
Official summary

The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with…

What is being procured?
Deadline May 29, 2026 06:00 UTC
Estimated valueNot announced
PublishedApr 28, 2026
Open official notice ↗

Official summary

What is being procured?

The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.

Notice history

Procurement timeline

Follow the main stages and updates linked to this procurement procedure.

  1. Competition notice Current notice

    · TED 290369-2026

    Open official notice ↗
  2. Result notice

    · TED 598555-2026

    Open official notice ↗

Data is restructured for easier reading. The official notice and procurement documents always prevail.

Source and reliability

TED · 290369-2026. Checked on Aug 21, 2026, 10:07 PM.

Data is restructured for easier reading. The official notice and procurement documents always prevail.

Report an error by email