Officielt resumé · English
Hvad indkøbes?
The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.
Vejledende maskinoversættelse. Det officielle resumé er fortsat gældende.
Officielt resumé · English
The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.
Gratis
Få de næste udbud i denne branche
Modtag en ugentlig e-mail med nye bekendtgørelser, der matcher dine kriterier. Tjek eller tilpas kriterierne, før du aktiverer din gratis besked.
Meddelelseshistorik
Udbudsforløb
Følg de vigtigste faser og opdateringer i dette udbud.
Data er omstruktureret for at være lettere at læse. Den officielle meddelelse og udbudsdokumenterne er altid gældende.
Kilde og pålidelighed
TED · 290369-2026. Kontrolleret 21. aug. 2026 22.07.
Data er omstruktureret for at være lettere at læse. Den officielle meddelelse og udbudsdokumenterne er altid gældende.