Sommarju uffiċjali · English
X’qed jiġi akkwistat?
The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.
Traduzzjoni awtomatika indikattiva. Is-sommarju uffiċjali jibqa’ r-referenza.
Sommarju uffiċjali · English
The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.
Ħieles
Irċievi s-sejħiet li jmiss f’dan is-settur
Irċievi email kull ġimgħa b’avviżi ġodda li jaqblu mal-kriterji tiegħek. Iċċekkja jew aġġusta l-kriterji qabel tattiva t-twissija bla ħlas.
Storja tal-avviżi
Kronoloġija tal-akkwist
Segwi l-istadji ewlenin u l-aġġornamenti marbuta ma’ din il-proċedura ta’ akkwist.
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Sors u affidabbiltà
TED · 290369-2026. Iċċekkjat fil-21 Aww 2026 22:07.
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