Oficiali santrauka · English
Kas perkama?
The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.
Informacinis mašininis vertimas. Oficialiai santraukai ir toliau teikiama pirmenybė.
Oficiali santrauka · English
The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.
Nemokama
Gaukite kitus šio sektoriaus pirkimus
Kas savaitę gaukite el. laišką su naujais jūsų kriterijus atitinkančiais skelbimais. Prieš įjungdami nemokamus pranešimus patikrinkite arba pakeiskite kriterijus.
Skelbimo istorija
Pirkimo procedūros laiko juosta
Sekite pagrindinius šios pirkimo procedūros etapus ir atnaujinimus.
Duomenys pertvarkyti, kad būtų lengviau skaityti. Oficialus skelbimas ir pirkimo dokumentai visada turi pirmenybę.
Šaltinis ir patikimumas
TED · 290369-2026. Patikrinta 2026-08-21 22:07.
Duomenys pertvarkyti, kad būtų lengviau skaityti. Oficialus skelbimas ir pirkimo dokumentai visada turi pirmenybę.