Germany · Laboratory, optical and precision equipment
Official title · Deutsch
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Official title · Deutsch
Flip Chip Die Bonder
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FAIR - Facility for Antiproton and Ion Research in Europe GmbH · Germany
View notices under this nameOfficial summary · Deutsch
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
Machine translation for guidance. The official summary remains authoritative.
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
Notice history
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Data is restructured for easier reading. The official notice and procurement documents always prevail.
TED · 667627-2026. Checked on Sep 29, 2026, 11:05 AM.
Data is restructured for easier reading. The official notice and procurement documents always prevail.
