Closed TED · Source · Language: Deutsch

Germany · Industrial machinery

Official title · Deutsch

CMP Anlage

Universität Siegen · Germany

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Official summary · Deutsch

What is being procured?

Anlage zum Planarisieren und Glätten von Oberflächen mittels chemisch-mechanischem Polieren (CMP, chemical mechanical polishing) zur Prozessierung von bis zu 6 Zoll großen Substraten

Deadline May 22, 2026 11:00 UTC+02:00
Estimated valueNot announced
PublishedApr 22, 2026
Open official notice ↗

Notice history

Procurement timeline

Follow the main stages and updates linked to this procurement procedure.

  1. Correction notice Current notice

    · TED 274500-2026

    Changed sections: 1 Open official notice ↗
  2. Result notice

    · TED 458651-2026

    Open official notice ↗

Data is restructured for easier reading. The official notice and procurement documents always prevail.

Source and reliability

TED · 274500-2026. Checked on Aug 21, 2026, 10:05 PM.

Data is restructured for easier reading. The official notice and procurement documents always prevail.

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