Opportunity summary
What is being procured?
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
Source and reliability
Source: official TED notice 548119-2026, last checked Aug 21, 2026, 8:06 PM. The original publication remains authoritative.
Data is restructured for easier reading. The official notice and procurement documents always prevail.