Sommarju tal-opportunità
X’qed jiġi akkwistat?
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
Sors u affidabbiltà
Sors: avviż uffiċjali tat-TED 548119-2026, iċċekkjat l-aħħar fil-21 Aww 2026 20:06. Il-pubblikazzjoni oriġinali tibqa’ awtorevoli.
Id-data hija ristrutturata biex tinqara aktar faċilment. L-avviż uffiċjali u d-dokumenti tal-akkwist dejjem jipprevalu.