Resumo da oportunidade
O que está a ser adquirido?
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
Fonte e fiabilidade
Fonte: anúncio oficial do TED 548119-2026, verificado pela última vez em 21 de ago de 2026 20:06. A publicação original continua a ser a referência.
Os dados são reorganizados para facilitar a leitura. O anúncio oficial e os documentos do concurso prevalecem sempre.