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The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
Allikas ja usaldusväärsus
Allikas: ametlik TEDi teade 548119-2026, viimati kontrollitud 21. aug 2026 20:06. Määravaks jääb algne väljaanne.
Andmed on lihtsamaks lugemiseks ümber struktureeritud. Alati on ülimuslikud ametlik teade ja hankedokumendid.