Mahdollisuuden yhteenveto
Mitä hankitaan?
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
Lähde ja luotettavuus
Lähde: virallinen TED-ilmoitus 548119-2026, tarkistettu viimeksi 21.8.2026 klo 20.06. Alkuperäinen julkaisu on edelleen ratkaiseva.
Tiedot on jäsennetty helpommin luettaviksi. Virallinen ilmoitus ja hankinta-asiakirjat ovat aina ratkaisevia.