Sammenfatning af muligheden
Hvad indkøbes?
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
Kilde og pålidelighed
Kilde: officiel TED-meddelelse 548119-2026, senest kontrolleret 21. aug. 2026 20.06. Den oprindelige offentliggørelse er fortsat gældende.
Data er omstruktureret for at være lettere at læse. Den officielle meddelelse og udbudsdokumenterne er altid gældende.