Resumen de la oportunidad
¿Qué se contrata?
The object of the tender process is an edge-handling sputtering cluster tool (later also “Equipment”). The Equipment is a sputtering cluster tool for 200-mm wafers with wafer edge-handling capability for the VTT Micronova cleanroom semiconductor front end. The procurement includes a deposition chamber with four magnetron sputtering sources. During transport and processing, the wafers are mechanically touched only at the wafer edge, and they can be flipped in vacuum between the processes. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
Fuente y fiabilidad
Fuente: anuncio oficial de TED 548119-2026, comprobado por última vez el 21 ago. 2026 20:06. La publicación original sigue siendo la referencia.
Los datos se reestructuran para facilitar su lectura. El anuncio oficial y los documentos de contratación siempre prevalecen.