Awarded TED · Source

Finland · Laboratory, optical and precision equipment

Official title · English

Wafer metrology

VTT Technical Research Centre of Finland Ltd · Finland

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Official summary

The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with…

What is being procured?
Deadline Not announced
Estimated valueNot announced
PublishedAug 31, 2026
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Official summary

What is being procured?

The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process was described in more detail in the invitation to tender documents.

Notice history

Procurement timeline

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  1. Competition notice

    · TED 290369-2026

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  2. Result notice Current notice

    · TED 598555-2026

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Data is restructured for easier reading. The official notice and procurement documents always prevail.

Source and reliability

TED · 598555-2026. Checked on Sep 3, 2026, 11:05 AM.

Data is restructured for easier reading. The official notice and procurement documents always prevail.

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