Ametlik kokkuvõte · English
Mida hangitakse?
The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process was described in more detail in the invitation to tender documents.
Abistav masintõlge. Ametlik kokkuvõte jääb määravaks.
Ametlik kokkuvõte · English
The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process was described in more detail in the invitation to tender documents.
Tasuta
Saage selle valdkonna järgmised hanked
Saate kord nädalas e-kirja uute teadetega, mis vastavad teie tingimustele. Enne tasuta teavituse aktiveerimist kontrollige või muutke tingimusi.
Teate ajalugu
Hankemenetluse ajajoon
Jälgige selle hankemenetlusega seotud põhietappe ja uuendusi.
Andmed on lihtsamaks lugemiseks ümber struktureeritud. Alati on ülimuslikud ametlik teade ja hankedokumendid.
Allikas ja usaldusväärsus
TED · 598555-2026. Kontrollitud 3. sept 2026 11:05.
Andmed on lihtsamaks lugemiseks ümber struktureeritud. Alati on ülimuslikud ametlik teade ja hankedokumendid.