Achoimre oifigiúil · English
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THE OBJECT OF THE TENDER PROCESS The object of the procurement is a 200 mm automated film stress and wafer bow analysis system using a non-contact laser scanning technique for the VTT Micronova cleanroom. The procurement includes a room temperature automated thin-film stress measurement system, cassette load lock, robot to handle the wafers, programmable automatic wafer scanning system, and analysis software. The tool should be designed to be used inside the clean room. The supplier will take to consideration the environmental conditions of the tool installation location and will work together with VTT to reduce the external impact on facility. The automated thin-film stress analysis system is for non-patterned, non-texture 200 mm wafer stress measurement. The technical specification of th
Meaisínaistriúchán mar threoir. Is í an achoimre oifigiúil an tagairt údarásach.
Achoimre oifigiúil · English
THE OBJECT OF THE TENDER PROCESS The object of the procurement is a 200 mm automated film stress and wafer bow analysis system using a non-contact laser scanning technique for the VTT Micronova cleanroom. The procurement includes a room temperature automated thin-film stress measurement system, cassette load lock, robot to handle the wafers, programmable automatic wafer scanning system, and analysis software. The tool should be designed to be used inside the clean room. The supplier will take to consideration the environmental conditions of the tool installation location and will work together with VTT to reduce the external impact on facility. The automated thin-film stress analysis system is for non-patterned, non-texture 200 mm wafer stress measurement. The technical specification of th
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TED · 342282-2026. Seiceáilte ar 22 Lún 2026 09:05.
Tá na sonraí athstruchtúrtha chun iad a léamh níos éasca. Is iad an fógra oifigiúil agus na doiciméid soláthair a bhíonn i réim i gcónaí.