Virallinen yhteenveto · Nederlands
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The high NA - EUV track will support a High NA EUV scanner it gets linked to. The track will prepare the wafers before the exposure, this is pre-treatment of the wafers before coating, the coating of underlayer and photo resist followed by a post application bake. After exposure the track will execute the post exposure bake and development of the photo sensitive material to get the pattern fixed. The track modules need to be precisely controlled to achieve superior results in uniformity within the wafer and from wafer to wafer. It also needs to enable the processing of a wide variety of materials to support the further scaling and continuous evolving semiconductor devices. The low NA - EUV track will support a Low NA EUV scanner it gets linked to.…
Suuntaa antava konekäännös. Virallinen yhteenveto on edelleen ensisijainen.
Virallinen yhteenveto · Nederlands
The high NA - EUV track will support a High NA EUV scanner it gets linked to. The track will prepare the wafers before the exposure, this is pre-treatment of the wafers before coating, the coating of underlayer and photo resist followed by a post application bake. After exposure the track will execute the post exposure bake and development of the photo sensitive material to get the pattern fixed. The track modules need to be precisely controlled to achieve superior results in uniformity within the wafer and from wafer to wafer. It also needs to enable the processing of a wide variety of materials to support the further scaling and continuous evolving semiconductor devices. The low NA - EUV track will support a Low NA EUV scanner it gets linked to.…
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Lähde ja luotettavuus
TED · 680011-2026. Tarkistettu 2.10.2026 klo 11.05.
Tiedot on jäsennetty helpommin luettaviksi. Virallinen ilmoitus ja hankinta-asiakirjat ovat aina ratkaisevia.