Supply, Delivery, Installation, Commissioning, Calibration and Validation of an Electroplating and Wet Processing System, for Tyndall National Institute, University College Cork (UCC)

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Tenders are sought for the Supply, Delivery, Installation, Commissioning, Calibration and Validation of an Electroplating and wet processing system, for Tyndall National Institute, University College Cork (UCC): The new electroplating tool will enhance the capabilities at the Tyndall National Institute for the development of photonic packaging solutions and interconnect technology through advanced interposers, 3D interconnects, and redistribution lines. We invite proposals for a tool that is capable providing the required technology to enable the development of these technologies. The system should be capable of void free plating and filling of both through glass via (TGV) and through silicon vias (TSV) structures on wafer sizes up to 300 mm in both gold and copper-based chemistries.…

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