Deep Reactive Ion Etching (DRIE) Si fluorine chemistry etcher

Oficiālais kopsavilkums · Deutsch

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The equipment to be procured is a Deep Reactive Ion Etching (DRIE) Si fluorine chemistry etcher. This will provide new capabilities of deep trench (Bosch process) and through-via etching to the IBC cleanroom. The equipment is procured through the MagKI investment programme which will provide advanced substrate structuring capabilites to the cleanroom which will be used in the final production of magnetic nanodevices for next-gen European based Artifical Intelligence. It will also offer near vertical sidewall profile of etched via's in Si, SiC as well as 2D materials, like graphene and MoS2. Beside the fulfilment of the criteria described under 2.…

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