Deposition Tool 8 Inch

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The Technical University of Munich - Chair of Technical Physics E23/WMI will acquire a UHV cluster System for the fabrication of superconducting circuits on 8 inch'' wafers. The system must provide UHV conditions and has to include an HV load-lock chamber, a central handling chamber, a UHV chamber for the evaporation of Al thin films, a UHV chamber for sputtering of superconductors, a UHV chamber for oxidation, a UHV chamber for Ar ion milling, and a flipping station. The system must allow metalizing both sides of the wafers in situ, with minimal backside particle contamination. The wafers should only be touched on the side (edge gripping).