Oficiālais kopsavilkums · English
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Within the CHIPS-JU NanoIC pilot line Tyndall is developing novel materials for embedded DRAM and 3D integration for future leading-edge integrated circuits. In NanoIC, Tyndall’s flexibility into materials integration will allow for rapid, short-cycle screening to reduce the cycle time in identifying and integrating highly performing materials to carry forward into IC development. Our role is to provide agile wafer scale nanofabrication and processing beyond silicon for the integration of selected new materials – Transition Metal Dichalcogenides (TMDs) and oxide semiconductor (OSC) – and FET device architectures. The NanoIC teams at Tyndall will synthesize thin film TMDs and OSCs and will fabricate and test a wide range of materials and devices. Other activities may include compound semico
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Oficiālais kopsavilkums · English
Within the CHIPS-JU NanoIC pilot line Tyndall is developing novel materials for embedded DRAM and 3D integration for future leading-edge integrated circuits. In NanoIC, Tyndall’s flexibility into materials integration will allow for rapid, short-cycle screening to reduce the cycle time in identifying and integrating highly performing materials to carry forward into IC development. Our role is to provide agile wafer scale nanofabrication and processing beyond silicon for the integration of selected new materials – Transition Metal Dichalcogenides (TMDs) and oxide semiconductor (OSC) – and FET device architectures. The NanoIC teams at Tyndall will synthesize thin film TMDs and OSCs and will fabricate and test a wide range of materials and devices. Other activities may include compound semico
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TED · 458590-2026. Pārbaudīts 2026. gada 23. aug. 11:05.
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