Officielt resumé · English
Hvad indkøbes?
Tenders are required to provide a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. The system will be used for high-resolution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-printed electronic components, interconnects, solder joints, micro-vias, and related laboratory samples. The proposed system must provide integrated hardware and software capabilities for high-resolution imaging, 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions such as image capturing and 2D/3D surface characterization. The system must operate as a fully integrated bench
Vejledende maskinoversættelse. Det officielle resumé er fortsat gældende.
Officielt resumé · English
Tenders are required to provide a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. The system will be used for high-resolution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-printed electronic components, interconnects, solder joints, micro-vias, and related laboratory samples. The proposed system must provide integrated hardware and software capabilities for high-resolution imaging, 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions such as image capturing and 2D/3D surface characterization. The system must operate as a fully integrated bench
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Kilde og pålidelighed
TED · 412329-2026. Kontrolleret 23. aug. 2026 02.05.
Data er omstruktureret for at være lettere at læse. Den officielle meddelelse og udbudsdokumenterne er altid gældende.