BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Tenderiva//Public procurement deadline//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
UID:582477-2026@tenderiva.com
DTSTAMP:20260824T094614Z
DTSTART:20260922T100000Z
SUMMARY:Tenderiva — Flip Chip Die Bonder
DESCRIPTION:Saksa · Laboratorio-\, optiset ja tarkkuuslaitteet\nFAIR - Fac
 ility for Antiproton and Ion Research in Europe GmbH\nTED 582477-2026\nhtt
 ps://ted.europa.eu/en/notice/-/detail/582477-2026
URL:https://tenderiva.com/fi/tender/582477-2026-germany-laboratory-optical-
 and-precision-equipments-excl-glasses-flip-chip-die-bonder
STATUS:CONFIRMED
TRANSP:TRANSPARENT
END:VEVENT
END:VCALENDAR