BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Tenderiva//Public procurement deadline//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
UID:631856-2026@tenderiva.com
DTSTAMP:20260914T031103Z
DTSTART:20261013T100000Z
SUMMARY:Tenderiva — Semi-automatic prober for characterization of 200 mm 
 wafers
DESCRIPTION:Saksamaa · Labori-\, optika- ja täppisseadmed\nIHP GmbH - Lei
 bniz-Institut für innovative Mikroelektronik\nTED 631856-2026\nhttps://te
 d.europa.eu/de/notice/-/detail/631856-2026
URL:https://tenderiva.com/et/tender/631856-2026-deutschland-maschinen-und-g
 erate-zum-prufen-und-messen-semi-automatic-prober-for-characterization-of-
 200-mm-wafers
STATUS:CONFIRMED
TRANSP:TRANSPARENT
END:VEVENT
END:VCALENDAR