BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Tenderiva//Public procurement deadline//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
UID:756518-2026@tenderiva.com
DTSTAMP:20261102T031552Z
DTSTART:20261202T100000Z
SUMMARY:Tenderiva — Automated 300 mm Die-to-Wafer thermocompression bondi
 ng tool - PR1275392-3460-W
DESCRIPTION:Γερμανία · Ηλεκτρικά μηχανήματα\, 
 συσκευές και αναλώσιμα\nFraunhofer-Gesellschaft\, Eink
 auf B12\nTED 756518-2026\nhttps://ted.europa.eu/de/notice/-/detail/756518-
 2026
URL:https://tenderiva.com/el/tender/756518-2026-deutschland-mikroelektronis
 che-maschinen-und-gerate-und-mikrosysteme-automated-300-mm-die-to-wafer-th
 ermocompression-bonding-tool-pr1275392-3460-w
STATUS:CONFIRMED
TRANSP:TRANSPARENT
END:VEVENT
END:VCALENDAR