BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Tenderiva//Public procurement deadline//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
UID:582477-2026@tenderiva.com
DTSTAMP:20260824T094907Z
DTSTART:20260922T100000Z
SUMMARY:Tenderiva — Flip Chip Die Bonder
DESCRIPTION:Германия · Лабораторно\, оптично и 
 прецизно оборудване\nFAIR - Facility for Antiproton and 
 Ion Research in Europe GmbH\nTED 582477-2026\nhttps://ted.europa.eu/en/not
 ice/-/detail/582477-2026
URL:https://tenderiva.com/bg/tender/582477-2026-germany-laboratory-optical-
 and-precision-equipments-excl-glasses-flip-chip-die-bonder
STATUS:CONFIRMED
TRANSP:TRANSPARENT
END:VEVENT
END:VCALENDAR